ÄÜÅÙÃ÷ À¯Åë ±â¼úÀÇ °ø°³Æ¯Ç㠰Ǽö´Â ¹Ì±¹ (1À§), Áß±¹ (2À§), ÀϺ» (3À§), ´ëÇѹα¹ (4À§), ÇÁ¶û½º (5À§), ´ë¸¸ (6À§), µ¶ÀÏ (7À§), ³×´ú¶õµå (8À§), ½º¿þµ§ (9À§), ¿µ±¹ (10À§) ¼øÀ¸·Î ¸¹ÀÌ °ø°³µÇ¾î ÀÖ´Ù.
ÀÌ·¯ÇÑ ±Û·Î¹ú ¼øÀ§¸¦ º¸¸é, ¹Ì±¹ ¹× Áß±¹ÀÌ ÄÜÅÙÃ÷ À¯Åë ±â¼úÀÇ ¿¬±¸ °³¹ß¿¡ ÁÖµµÀûÀÎ ¿ªÇÒÀ» ÇÏ°í ÀÖ´Â °ÍÀ¸·Î ºÐ¼®µÈ´Ù.
ÄÜÅÙÃ÷ À¯Åë ±â¼úÀÇ °ø°³Æ¯Ç㠰Ǽö´Â SAMSUNG ELECTRONICS CO LTD (1À§), HUAWEI TECHNOLOGIES CO LTD (2À§), QUALCOMM INC (3À§), ZTE CORP (4À§),
SONY CORPORATION (5À§), INTEL CORP (6À§), TOPPAN PRINTING CO LTD (7À§), TELEFONAKTIEBOLAGET LM ERICSSON (8À§), LG ELECTRONICS INC (9À§), IBM (10À§) ¼øÀ¸·Î ¸¹ÀÌ °ø°³µÇ¾î ÀÖ´Ù.
ÄÜÅÙÃ÷ À¯Åë ±â¼úÀÇ ±â¼ú¿µÇâ·Â Áö¼ö´Â ¹Ì±¹ (1), ÀϺ» (2), ´ëÇѹα¹ (3), Çɶõµå (4), ij³ª´Ù (5), ÇÁ¶û½º (6), ½º¿þµ§ (7), À̽º¶ó¿¤ (8), ³×´ú¶õµå (9), Áß±¹ (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, ¹Ì±¹ ¹× ÀϺ»ÀÇ ÄÜÅÙÃ÷ À¯Åë¿¡ ´ëÇÑ ±â¼ú¿µÇâ·ÂÀº ¸Å¿ì ³ôÀº °ÍÀ¸·Î ºÐ¼®µÈ´Ù.
Overview .....................................................................6
Vision ..........................................................................6
Business Information .................................................. 7
ÄÜÅÙÃ÷ À¯Åë .................................................................. 9
1. ¸Þ°¡ Æ®·»µå............................................................... 9
1) ±â¼ú º° Æ®·»µå...........................................................9
2) ±â¼ú¿µÇâ·Â Æ®·»µå................................................... 11
3) ½ÃÀåÀü¸Á Æ®·»µå ..................................................... 12
4) R&D ÅõÀÚ Æ®·»µå ................................................... 13
2. ¼±µµ±¹°¡ Æ®·»µå.......................................................15
1) ±¹°¡ º° µ¥ÀÌÅÍ.........................................................15
2) ±¹°¡ º° Æ®·»µå.........................................................16
U.S.A........................................................................16
China........................................................................17
Japan........................................................................17
3. ¼±µµ±â¾÷ Æ®·»µå.......................................................23
1) ±â¾÷ º° µ¥ÀÌÅÍ.........................................................23
2) ±â¾÷ º° Æ®·»µå........................................................ 24
SAMSUNG ELECTRONICS CO LTD..............................24
HUAWEI TECHNOLOGIES CO LTD............................. 25
QUALCOMM INC...................................................... 26
4. ±â¼ú¿µÇâ·Â.............................................................32
4-1) ¼±µµ±¹°¡ ¼øÀ§ ....................................................32
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â.....................................33
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö..............................35
4-2) ¼±µµ±â¾÷ ¼øÀ§.....................................................37
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â.................................... 38
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö..............................40
5. ½ÃÀåÀü¸Á................................................................43
5-1) ¼±µµ±¹°¡ ¼øÀ§ ....................................................43
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á........................................44
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö ................................ 46
5-2) ¼±µµ±â¾÷ ¼øÀ§ ....................................................48
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á...........................................49
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö.................................51
6. R&D ÅõÀÚ.............................................................54
6-1) ¼±µµ±¹°¡ ¼øÀ§ ...................................................54
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ..............................55
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö ............................. 57
6-2) ¼±µµ±â¾÷ ¼øÀ§ .................................................. 59
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ.............................60
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö............................. 63