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ÀÚÀ²ÁÖÇàÂ÷ Â÷·®Åë½Å/º¸¾È : µ¥ÀÌÅÍ ºÐ¼®

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Â÷·®Åë½Å/º¸¾È ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â ¹Ì±¹ (1), µ¶ÀÏ (2), ÇÁ¶û½º (3), ÀϺ» (4), Áß±¹ (5), ´ëÇѹα¹ (6), ¿µ±¹ (7), ½º¿þµ§ (8), ij³ª´Ù (9), ³×´ú¶õµå (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, ¹Ì±¹ ¹× µ¶ÀÏÀº Â÷·®Åë½Å/º¸¾È ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.

Â÷·®Åë½Å/º¸¾È ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â QUALCOMM INC (1), SAMSUNG ELECTRONICS CO LTD (2), MOTOROLA INC (3), HARRIS CORP (4),
SIEMENS CORPORATION (5), TELEFONAKTIEBOLAGET LM ERICSSON (6), INTEL CORP (7), LG ELECTRONICS INC (8), FORD GLOBAL TECHNOLOGIES INC (9), HUAWEI TECHNOLOGIES CO LTD (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, QUALCOMM INC ¹× SAMSUNG ELECTRONICS CO LTD ±â¾÷Àº Â÷·®Åë½Å/º¸¾È ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.

Â÷·®Åë½Å/º¸¾È ±â¼úÀÇ R&D ÅõÀÚÀ²Àº ¹Ì±¹ (1), µ¶ÀÏ (2), Áß±¹ (3), ÀϺ» (4), ÇÁ¶û½º (5), ´ëÇѹα¹ (6), ¿µ±¹ (7), ½º¿þµ§ (8), ij³ª´Ù (9), ´ë¸¸ (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, ¹Ì±¹ ¹× µ¶ÀÏÀÇ Â÷·®Åë½Å/º¸¾È ±â¼ú¿¡ ´ëÇÑ R&D ÅõÀÚ°¡ ¸Å¿ì È°¹ßÇÑ °ÍÀ¸·Î ºÐ¼®µÈ´Ù.

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Overview ....................................................................6
Vision .........................................................................6
Business Information ................................................. 7

Â÷·®Åë½Å/º¸¾È .............................................................. 9

1. ¸Þ°¡ Æ®·»µå............................................................ 9
1) ±â¼ú º° Æ®·»µå.........................................................9
2) ±â¼ú¿µÇâ·Â Æ®·»µå................................................. 12
3) ½ÃÀåÀü¸Á Æ®·»µå ................................................... 13
4) R&D ÅõÀÚ Æ®·»µå ................................................. 14

2. ¼±µµ±¹°¡ Æ®·»µå.....................................................16
1) ±¹°¡ º° µ¥ÀÌÅÍ.......................................................16
2) ±¹°¡ º° Æ®·»µå.......................................................17
China.......................................................................17
U.S.A........................................................................18
Germany...................................................................18

3. ¼±µµ±â¾÷ Æ®·»µå.....................................................24
1) ±â¾÷ º° µ¥ÀÌÅÍ.......................................................24
2) ±â¾÷ º° Æ®·»µå...................................................... 25
SAMSUNG ELECTRONICS CO LTD.............................25
QUALCOMM INC...................................................... 26
HUAWEI TECHNOLOGIES CO LTD............................ 26

4. ±â¼ú¿µÇâ·Â...........................................................33
4-1) ¼±µµ±¹°¡ ¼øÀ§ ................................................33
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â...............................34
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö........................36
4-2) ¼±µµ±â¾÷ ¼øÀ§.................................................38
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â.............................. 39
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö........................41

5. ½ÃÀåÀü¸Á.............................................................44
5-1) ¼±µµ±¹°¡ ¼øÀ§ ...............................................44
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á.................................45
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö ........................ 47

5-2) ¼±µµ±â¾÷ ¼øÀ§ ...............................................49
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á...................................50
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö.........................52

6. R&D ÅõÀÚ..........................................................55
6-1) ¼±µµ±¹°¡ ¼øÀ§ ...............................................55
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ.......................56
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö ...................... 58
6-2) ¼±µµ±â¾÷ ¼øÀ§ ..............................................60
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ.......................61
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö........................64