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2022-03-25
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ºí·ÏüÀÎ ±â¹Ý ±â¼úÀÇ °ø°³Æ¯Ç㠰Ǽö´Â Áß±¹ (1À§), ¹Ì±¹ (2À§), ÀϺ» (3À§), ´ëÇѹα¹ (4À§), µ¶ÀÏ (5À§), ÇÁ¶û½º (6À§), ¿µ±¹ (7À§), ij³ª´Ù (8À§), ´ë¸¸ (9À§), ½ºÀ§½º (10À§) ¼øÀ¸·Î ¸¹ÀÌ °ø°³µÇ¾î ÀÖ´Ù.
ÀÌ·¯ÇÑ ±Û·Î¹ú ¼øÀ§¸¦ º¸¸é, Áß±¹ ¹× ¹Ì±¹ÀÌ ºí·ÏüÀÎ ±â¹Ý ±â¼úÀÇ ¿¬±¸ °³¹ß¿¡ ÁÖµµÀûÀÎ ¿ªÇÒÀ» ÇÏ°í ÀÖ´Â °ÍÀ¸·Î ºÐ¼®µÈ´Ù.

ºí·ÏüÀÎ ±â¹Ý ±â¼úÀÇ °ø°³Æ¯Ç㠰Ǽö´Â IBM (1À§), HUAWEI TECHNOLOGIES CO LTD (2À§), STATE GRID CORP CHINA (3À§), QUALCOMM INC (4À§), TENCENT TECH SHENZHEN CO LTD (5À§),
TERAOKA SEIKO CO LTD (6À§), MASTERCARD INTERNATIONAL INC (7À§), SAMSUNG ELECTRONICS CO LTD (8À§), SEIKO EPSON CORP (9À§), INTEL CORP (10À§) ¼øÀ¸·Î ¸¹ÀÌ °ø°³µÇ¾î ÀÖ´Ù.

ºí·ÏüÀÎ ±â¹Ý ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â ¹Ì±¹ (1), ÀϺ» (2), Áß±¹ (3), ÇÁ¶û½º (4), µ¶ÀÏ (5), ´ëÇѹα¹ (6), ³×´ú¶õµå (7), ¿µ±¹ (8), ½ºÀ§½º (9), ij³ª´Ù (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, ¹Ì±¹ ¹× ÀϺ»Àº ºí·ÏüÀÎ ±â¹Ý ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.

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Overview ..........................................................................6
Vision ................................................................................6
Business Information ........................................................ 7

ºí·ÏüÀÎ............................................................................. 9

1. ¸Þ°¡ Æ®·»µå.................................................................... 9
1) ±â¼ú º° Æ®·»µå.................................................................9
2) ±â¼ú¿µÇâ·Â Æ®·»µå.......................................................... 14
3) ½ÃÀåÀü¸Á Æ®·»µå ............................................................ 16
4) R&D ÅõÀÚ Æ®·»µå .......................................................... 18

2. ¼±µµ±¹°¡ Æ®·»µå...............................................................20
1) ±¹°¡ º° µ¥ÀÌÅÍ..................................................................20
2) ±¹°¡ º° Æ®·»µå..................................................................21
China ..................................................................................21
U.S.A...................................................................................22
Japan...................................................................................22
Korea...................................................................................23
Germany .............................................................................24
France .................................................................................24
Britain. .................................................................................25
Canada.................................................................................26
Taiwan ................................................................................ 26
Switzerland..........................................................................27

3. ¼±µµ±â¾÷ Æ®·»µå.................................................................28
1) ±â¾÷ º° µ¥ÀÌÅÍ...................................................................28
2) ±â¾÷ º° Æ®·»µå................................................................... 29
IBM.......................................................................................29
HUAWEI TECHNOLOGIES CO LTD.......................................... 30
STATE GRID CORP CHINA...................................................... 31
QUALCOMM INC................................................................... 31
TENCENT TECH SHENZHEN CO LTD......................................32
TERAOKA SEIKO CO LTD....................................................... 33
MASTERCARD INTERNATIONAL INC...................................... 33
SAMSUNG ELECTRONICS CO LTD.......................................... 34
SEIKO EPSON CORP.............................................................. 35
INTEL CORP...........................................................................36

4. ±â¼ú¿µÇâ·Â.........................................................................37
4-1) ¼±µµ±¹°¡ ¼øÀ§ ...............................................................37
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â.............................................38
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö.......................................40
4-2) ¼±µµ±â¾÷ ¼øÀ§................................................................42
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â............................................. 43
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö.......................................46

5. ½ÃÀåÀü¸Á.............................................................................49
5-1) ¼±µµ±¹°¡ ¼øÀ§ ................................................................49
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á..................................................50
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö .......................................... 52
5-2) ¼±µµ±â¾÷ ¼øÀ§ ................................................................54
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á.....................................................55
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö...........................................58

6. R&D ÅõÀÚ............................................................................61
6-1) ¼±µµ±¹°¡ ¼øÀ§ .................................................................61
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ..........................................62
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö ......................................... 64
6-2) ¼±µµ±â¾÷ ¼øÀ§ ................................................................ 66
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ..........................................67
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö.......................................... 70