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»ç¹°ÀÎÅÍ³Ý : µ¥ÀÌÅÍ ºÐ¼®

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2022-03-28
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»ç¹°ÀÎÅÍ³Ý ±â¼úÀÇ °ø°³Æ¯Ç㠰Ǽö´Â STATE GRID CORP CHINA (1À§), SAMSUNG ELECTRONICS CO LTD (2À§), HUAWEI TECHNOLOGIES CO LTD (3À§), QUALCOMM INC (4À§),
IBM (5À§), ZTE CORP (6À§), INTEL CORP (7À§), ETRI (8À§), MICROSOFT CORP (9À§), TELEFONAKTIEBOLAGET LM ERICSSON (10À§) ¼øÀ¸·Î ¸¹ÀÌ °ø°³µÇ¾î ÀÖ´Ù.

»ç¹°ÀÎÅÍ³Ý ±â¼úÀÇ ±â¼ú¿µÇâ·Â Áö¼ö´Â ´ëÇѹα¹ (1), Áß±¹ (2), ¹Ì±¹ (3), ÀϺ» (4), ´ë¸¸ (5), Çɶõµå (6), µ¶ÀÏ (7), ³×´ú¶õµå (8), ÇÁ¶û½º (9), ½º¿þµ§ (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, ´ëÇѹα¹ ¹× Áß±¹ÀÇ »ç¹°ÀÎÅͳݿ¡ ´ëÇÑ ±â¼ú¿µÇâ·ÂÀº ¸Å¿ì ³ôÀº °ÍÀ¸·Î ºÐ¼®µÈ´Ù.

»ç¹°ÀÎÅÍ³Ý ±â¼úÀÇ ±â¼ú¿µÇâ·Â Áö¼ö´Â SAMSUNG ELECTRONICS CO LTD (1), IBM (2), QUALCOMM INC (3), MICROSOFT CORP (4), INTEL CORP (5),
TELEFONAKTIEBOLAGET LM ERICSSON (6), HUAWEI TECHNOLOGIES CO LTD (7), SIEMENS CORPORATION (8), ZTE CORP (9), STATE GRID CORP CHINA (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, SAMSUNG ELECTRONICS CO LTD ¹× IBMÀÇ »ç¹°ÀÎÅͳݿ¡ ´ëÇÑ ±â¼ú¿µÇâ·ÂÀº ¸Å¿ì ³ôÀº °ÍÀ¸·Î ºÐ¼®µÈ´Ù.

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Overview ..................................................................6
Vision .......................................................................6
Business Information ................................................ 7

»ç¹°ÀÎÅͳÝ................................................................. 9

1. ¸Þ°¡ Æ®·»µå............................................................ 9
1) ±â¼ú º° Æ®·»µå.........................................................9
2) ±â¼ú¿µÇâ·Â Æ®·»µå................................................. 12
3) ½ÃÀåÀü¸Á Æ®·»µå ................................................... 13
4) R&D ÅõÀÚ Æ®·»µå ................................................. 14

2. ¼±µµ±¹°¡ Æ®·»µå.....................................................16
1) ±¹°¡ º° µ¥ÀÌÅÍ.......................................................16
2) ±¹°¡ º° Æ®·»µå.......................................................17
China .....................................................................17
U.S.A......................................................................18
Korea......................................................................18

3. ¼±µµ±â¾÷ Æ®·»µå.....................................................24
1) ±â¾÷ º° µ¥ÀÌÅÍ......................................................24
2) ±â¾÷ º° Æ®·»µå..................................................... 25
STATE GRID CORP CHINA.......................................25
SAMSUNG ELECTRONICS CO LTD..........................26
HUAWEI TECHNOLOGIES CO LTD.......................... 27

4. ±â¼ú¿µÇâ·Â..........................................................33
4-1) ¼±µµ±¹°¡ ¼øÀ§ .................................................33
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â..................................34
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö...........................36
4-2) ¼±µµ±â¾÷ ¼øÀ§.................................................38
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â................................ 39
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö..........................41

5. ½ÃÀåÀü¸Á...........................................................44
5-1) ¼±µµ±¹°¡ ¼øÀ§ ...............................................44
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á...................................45
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö .......................... 47
5-2) ¼±µµ±â¾÷ ¼øÀ§ ..............................................49
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á.....................................50
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö...........................52

6. R&D ÅõÀÚ........................................................55
6-1) ¼±µµ±¹°¡ ¼øÀ§ ..............................................55
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ.........................56
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö ........................ 58
6-2) ¼±µµ±â¾÷ ¼øÀ§ ............................................. 60
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ.........................61
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö......................... 64