°í½Å·Ú ±â¼úÀÇ °ø°³Æ¯Ç㠰Ǽö´Â Áß±¹ (1À§), ¹Ì±¹ (2À§), ÀϺ» (3À§), ´ëÇѹα¹ (4À§), µ¶ÀÏ (5À§), ´ë¸¸ (6À§), ÇÁ¶û½º (7À§), ³×´ú¶õµå (8À§), ¿µ±¹ (9À§), ½ºÀ§½º (10À§) ¼øÀ¸·Î ¸¹ÀÌ °ø°³µÇ¾î ÀÖ´Ù.
ÀÌ·¯ÇÑ ±Û·Î¹ú ¼øÀ§¸¦ º¸¸é, Áß±¹ ¹× ¹Ì±¹ÀÌ °í½Å·Ú ±â¼úÀÇ ¿¬±¸ °³¹ß¿¡ ÁÖµµÀûÀÎ ¿ªÇÒÀ» ÇÏ°í ÀÖ´Â °ÍÀ¸·Î ºÐ¼®µÈ´Ù.
°í½Å·Ú ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â ¹Ì±¹ (1), ÀϺ» (2), µ¶ÀÏ (3), ÇÁ¶û½º (4), Áß±¹ (5), ´ëÇѹα¹ (6), ³×´ú¶õµå (7), ´ë¸¸ (8), ¿µ±¹ (9), ½ºÀ§½º (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, ¹Ì±¹ ¹× ÀϺ»Àº °í½Å·Ú ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.
°í½Å·Ú ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â SAMSUNG ELECTRONICS CO LTD (1), INTEL CORP (2), SIEMENS CORPORATION (3), QUALCOMM INC (4),
IBM (5), KONINKLIJKE PHILIPS ELECTRONICS N V (6), THOMSON LICENSING (7), MICROJET TECHNOLOGY CO LTD (8), INFINEON TECHNOLOGIES AG (9), LG ELECTRONICS INC (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, SAMSUNG ELECTRONICS CO LTD ¹× INTEL CORP ±â¾÷Àº °í½Å·Ú ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.
Overview.............................................................................. 6
Vision....................................................................................6
Business Information ............................................................7
Áö´ÉÇü¹ÝµµÃ¼ ? °í½Å·Ú±â¼ú...................................................... 9
1. ¸Þ°¡ Æ®·»µå........................................................................ 9
1) ±â¼ú º° Æ®·»µå.................................................................... 9
2) ±â¼ú¿µÇâ·Â Æ®·»µå..............................................................11
3) ½ÃÀåÀü¸Á Æ®·»µå ............................................................... 12
4) R&D ÅõÀÚ Æ®·»µå ............................................................. 13
2. ¼±µµ±¹°¡ Æ®·»µå................................................................ 15
1) ±¹°¡ º° µ¥ÀÌÅÍ.................................................................. 15
2) ±¹°¡ º° Æ®·»µå.................................................................. 16
China .................................................................................16
U.S.A..................................................................................17
Japan..................................................................................17
Korea..................................................................................18
Germany.............................................................................19
Taiwan................................................................................19
France.................................................................................20
Netherlands.........................................................................21
Britain..................................................................................21
Switzerland......................................................................... 22
3. ¼±µµ±â¾÷ Æ®·»µå................................................................. 23
1) ±â¾÷ º° µ¥ÀÌÅÍ................................................................... 23
2) ±â¾÷ º° Æ®·»µå................................................................... 24
INTEL CORP..........................................................................24
IBM......................................................................................25
SAMSUNG ELECTRONICS CO LTD.........................................25
SIEMENS CORPORATION......................................................26
MICROJET TECHNOLOGY CO LTD.........................................27
QUALCOMM INC..................................................................27
STATE GRID CORP CHINA.....................................................28
INFINEON TECHNOLOGIES AG.............................................29
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD........ 29
TEXAS INSTRUMENTS INC.................................................. 30
4. ±â¼ú¿µÇâ·Â........................................................................32
4-1) ¼±µµ±¹°¡ ¼øÀ§ .............................................................. 32
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â................................................33
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö........................................ 35
4-2) ¼±µµ±â¾÷ ¼øÀ§............................................................... 37
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â................................................38
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö........................................ 40
5. ½ÃÀåÀü¸Á..........................................................................43
5-1) ¼±µµ±¹°¡ ¼øÀ§...............................................................43
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á..................................................44
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö .......................................... 46
5-2) ¼±µµ±â¾÷ ¼øÀ§ ..............................................................48
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á.....................................................49
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö.......................................... 51
6. R&D ÅõÀÚ....................................................................... 54
6-1) ¼±µµ±¹°¡ ¼øÀ§ ..............................................................54
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ........................................ 55
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö .........................................57
6-2) ¼±µµ±â¾÷ ¼øÀ§ ............................................................. 59
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ........................................ 60
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö..........................................63