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Áö´ÉÇü¹ÝµµÃ¼ - ÀΰøÁö´É : µ¥ÀÌÅÍ ºÐ¼®

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ÀΰøÁö´É ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â ¹Ì±¹ (1), Áß±¹ (2), ÀϺ» (3), ´ëÇѹα¹ (4), µ¶ÀÏ (5), ÇÁ¶û½º (6), ij³ª´Ù (7), ´ë¸¸ (8), ³×´ú¶õµå (9), ½ºÀ§½º (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, ¹Ì±¹ ¹× Áß±¹Àº ÀΰøÁö´É ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.

ÀΰøÁö´É ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â IBM (1), QUALCOMM INC (2), INTEL CORP (3), SAMSUNG ELECTRONICS CO LTD (4), HUAWEI TECHNOLOGIES CO LTD (5),
ZTE CORP (6), LG ELECTRONICS INC (7), STATE GRID CORP CHINA (8), TENCENT TECH SHENZHEN CO LTD (9), PING AN TECH SHENZHEN CO LTD (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, IBM ¹× QUALCOMM INC ±â¾÷Àº ÀΰøÁö´É ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.

ÀΰøÁö´É ±â¼úÀÇ R&D ÅõÀÚÀ²Àº ¹Ì±¹ (1), Áß±¹ (2), ÀϺ» (3), ´ëÇѹα¹ (4), µ¶ÀÏ (5), ´ë¸¸ (6), ÇÁ¶û½º (7), ij³ª´Ù (8), ¿µ±¹ (9), ³×´ú¶õµå (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, ¹Ì±¹ ¹× Áß±¹ÀÇ ÀΰøÁö´É ±â¼ú¿¡ ´ëÇÑ R&D ÅõÀÚ°¡ ¸Å¿ì È°¹ßÇÑ °ÍÀ¸·Î ºÐ¼®µÈ´Ù.

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Overview.................................................................................. 6
Vision........................................................................................6
Business Information ................................................................7

Áö´ÉÇü¹ÝµµÃ¼ ? ÀΰøÁö´É............................................................. 9
.
1. ¸Þ°¡ Æ®·»µå.......................................................................... 9
1) ±â¼ú º° Æ®·»µå...................................................................... 9
2) ±â¼ú¿µÇâ·Â Æ®·»µå................................................................13
3) ½ÃÀåÀü¸Á Æ®·»µå ................................................................. 14
4) R&D ÅõÀÚ Æ®·»µå ............................................................... 16

2. ¼±µµ±¹°¡ Æ®·»µå.............................................................. ....18
1) ±¹°¡ º° µ¥ÀÌÅÍ..................................................................... 18
2) ±¹°¡ º° Æ®·»µå..................................................................... 19
China ..................................................................................... 19
U.S.A...................................................................................... 20
Korea...................................................................................... 20
Japan...................................................................................... 21
Taiwan.....................................................................................22
Germany..................................................................................22
France.....................................................................................23
Canada................................................................................... 24
Netherlands............................................................................ 24
Britain..................................................................................... 25

3. ¼±µµ±â¾÷ Æ®·»µå................................................................... 26
1) ±â¾÷ º° µ¥ÀÌÅÍ...................................................................... 26
2) ±â¾÷ º° Æ®·»µå...................................................................... 27
SAMSUNG ELECTRONICS CO LTD............................................. 27
STATE GRID CORP CHINA.......................................................... 28
INTEL CORP............................................................................. 28
IBM.......................................................................................... 29
PING AN TECH SHENZHEN CO LTD........................................... 30
TENCENT TECH SHENZHEN CO LTD..........................................30
HUAWEI TECHNOLOGIES CO LTD............................................. 31
QUALCOMM INC...................................................................... 32
ZTE CORP................................................................................ 32
GREE ELECTRIC APPLIANCES INC ZHUHAI................................ 33

4. ±â¼ú¿µÇâ·Â........................................................................... 34
4-1) ¼±µµ±¹°¡ ¼øÀ§ ................................................................ 34
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â............................................... 35
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö........................................ 37
4-2) ¼±µµ±â¾÷ ¼øÀ§................................................................. 39
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â...............................................40
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö........................................ 42

5. ½ÃÀåÀü¸Á.............................................................................. 45
5-1) ¼±µµ±¹°¡ ¼øÀ§..................................................................45
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á.................................................. 46
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö ........................................... 48
5-2) ¼±µµ±â¾÷ ¼øÀ§ .................................................................50
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á..................................................... 51
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö........................................... 54

6. R&D ÅõÀÚ............................................................................ 57
6-1) ¼±µµ±¹°¡ ¼øÀ§ .................................................................57
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ......................................... 58
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö ..........................................60
6-2) ¼±µµ±â¾÷ ¼øÀ§ ................................................................. 62
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ......................................... 63
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö.......................................... 66