Àú¼ÒºñÀü·Â ±â¼úÀÇ ½ÃÀåÀü¸Á Áö¼ö´Â QUALCOMM INC (1), INFINEON TECHNOLOGIES AG (2), IBM (3), SAMSUNG ELECTRONICS CO LTD (4),
INTEL CORP (5), TOSHIBA CORP (6), MICROJET TECHNOLOGY CO LTD (7), SEMICONDUCTOR ENERGY LAB CO LTD (8), TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (9), RENESAS ELECTRONICS CORP (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î À¯ÃßÇØ º¼ ¶§, QUALCOMM INC ¹× INFINEON TECHNOLOGIES AG ±â¾÷Àº Àú¼ÒºñÀü·Â ±â¼ú¿¡ ´ëÇÑ ¹Ì·¡ ½ÃÀåÀ» ¸Å¿ì ±àÁ¤ÀûÀ¸·Î Àü¸ÁÇÏ°í ÀÖ´Ù.
Àú¼ÒºñÀü·Â ±â¼úÀÇ R&D ÅõÀÚÀ²Àº ÀϺ» (1), ¹Ì±¹ (2), ´ëÇѹα¹ (3), Áß±¹ (4), µ¶ÀÏ (5), ´ë¸¸ (6), ÇÁ¶û½º (7), ³×´ú¶õµå (8), ¿µ±¹ (9), ½Ì°¡Æú (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, ÀϺ» ¹× ¹Ì±¹ÀÇ Àú¼ÒºñÀü·Â ±â¼ú¿¡ ´ëÇÑ R&D ÅõÀÚ°¡ ¸Å¿ì È°¹ßÇÑ °ÍÀ¸·Î ºÐ¼®µÈ´Ù.
Àú¼ÒºñÀü·Â ±â¼úÀÇ R&D ÅõÀÚÀ²Àº TOSHIBA CORP (1), IBM (2), SAMSUNG ELECTRONICS CO LTD (3), INFINEON TECHNOLOGIES AG (4),
QUALCOMM INC (5), MICROJET TECHNOLOGY CO LTD (6), TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (7), INTEL CORP (8), SEMICONDUCTOR ENERGY LAB CO LTD (9), RENESAS ELECTRONICS CORP (10) ¼øÀ¸·Î ³ô´Ù.
ÀÌ·Î ¹Ì·ç¾î º¼ ¶§, TOSHIBA CORP ¹× IBMÀÇ Àú¼ÒºñÀü·Â ±â¼ú¿¡ ´ëÇÑ R&D ÅõÀÚ°¡ ¸Å¿ì È°¹ßÇÑ °ÍÀ¸·Î ºÐ¼®µÈ´Ù.
Overview................................................................................. 6
Vision.......................................................................................6
Business Information ...............................................................7
Áö´ÉÇü¹ÝµµÃ¼ ? Àú¼ÒºñÀü·Â ±â¼ú................................................... 9
1. ¸Þ°¡ Æ®·»µå......................................................................... 9
1) ±â¼ú º° Æ®·»µå..................................................................... 9
2) ±â¼ú¿µÇâ·Â Æ®·»µå...............................................................12
3) ½ÃÀåÀü¸Á Æ®·»µå ................................................................ 13
4) R&D ÅõÀÚ Æ®·»µå .............................................................. 14
2. ¼±µµ±¹°¡ Æ®·»µå.................................................................. 16
1) ±¹°¡ º° µ¥ÀÌÅÍ.................................................................... 16
2) ±¹°¡ º° Æ®·»µå..................................................................... 17
U.S.A ..................................................................................... 17
Japan...................................................................................... 18
China...................................................................................... 18
Taiwan.................................................................................... 19
Korea...................................................................................... 20
Germany................................................................................. 20
France.................................................................................... 21
Netherlands........................................................................... 22
Britain.................................................................................... 22
Singapore.............................................................................. 23
3. ¼±µµ±â¾÷ Æ®·»µå................................................................... 24
1) ±â¾÷ º° µ¥ÀÌÅÍ..................................................................... 24
2) ±â¾÷ º° Æ®·»µå..................................................................... 25
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD............. 25
IBM......................................................................................... 26
SAMSUNG ELECTRONICS CO LTD............................................ 26
QUALCOMM INC...................................................................... 27
INTEL CORP............................................................................. 28
TOSHIBA CORP.........................................................................28
SEMICONDUCTOR ENERGY LAB CO LTD................................... 29
INFINEON TECHNOLOGIES AG.................................................. 30
MICROJET TECHNOLOGY CO LTD............................................. 31
RENESAS ELECTRONICS CORP................................................. 32
4. ±â¼ú¿µÇâ·Â.......................................................................... 33
4-1) ¼±µµ±¹°¡ ¼øÀ§ ................................................................ 33
4-1-1) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â.............................................. 34
4-1-2) ¼±µµ±¹°¡ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö....................................... 36
4-2) ¼±µµ±â¾÷ ¼øÀ§................................................................ 38
4-2-1) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â..............................................39
4-2-2) ¼±µµ±â¾÷ÀÇ ±â¼ú¿µÇâ·Â Áö¼ö...................................... 41
5. ½ÃÀåÀü¸Á........................................................................... 44
5-1) ¼±µµ±¹°¡ ¼øÀ§...............................................................44
5-1-1) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á............................................... 45
5-1-2) ¼±µµ±¹°¡ÀÇ ½ÃÀåÀü¸Á Áö¼ö ....................................... 47
5-2) ¼±µµ±â¾÷ ¼øÀ§ .............................................................49
5-2-1) ¼±µµ±â¾÷ ½ÃÀåÀü¸Á..................................................50
5-2-2) ¼±µµ±â¾÷ÀÇ ½ÃÀåÀü¸Á Áö¼ö....................................... 53
6. R&D ÅõÀÚ....................................................................... 56
6-1) ¼±µµ±¹°¡ ¼øÀ§ ............................................................56
6-1-1) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚ ÃßÀÌ.................................... 57
6-1-2) ¼±µµ±¹°¡ÀÇ R&D ÅõÀÚÁö¼ö .....................................59
6-2) ¼±µµ±â¾÷ ¼øÀ§ ............................................................ 61
6-2-1) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚ ÃßÀÌ..................................... 62
6-2-2) ¼±µµ±â¾÷ÀÇ R&D ÅõÀÚÁö¼ö...................................... 65